Research-CMUT Microfabrication
CMUT Microfabrication
Our CMUT microfabrication is based on the direct wafer bonding technology. The process steps include n-type doping, thermal wet/dry oxide growth, RIE-SiO2 etching, diamond CVD deposition, LPCVD- HTO deposition, RIE-Carbon etching, CMP-SiO2, CMP-C, metal sputtering and etching.
Figure 1. Scanning acoustic microscopy (SAM) image of direct bonded oxide-oxide surfaces.
Figure 2. CMUT with diamond membranes under Hirox microscope.
Figure 3. 2-D scan of CMUT with diamond membranes using Dektak 8 Profilometer.